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2016 The International Conference on Nanomaterial, Semiconductor and Composite Materials
(ICNSCM2016)
June 18-19, 2016   Singapore
www.icnscm.org

 

Good News: The fifth round of calling for paper begins, and the submission deadline has been extended to May 24,2016. Please grasp the chance and submit your paper!

好消息:ICNSCM2016第五轮征稿已经开始,本轮截稿日期为2016年5月24日,请大家抓住机会投稿!

Note: Due to scheduling conflicts,ICNSCM2016 delay to June 18-19th,all papers accept by ICNSCM2016 will be submitted to the press before the conference. We feel so sorry to make trouble for you. If you have any questions, please feel free to contact us. TEL:024-83958379-813. Email:cfp@icnscm.org. Since the delay of conference, we increased a round of calling for paper. Welcome for your submission. The schedule of conference will be announced half a month before the conference. Thank you!

通知:由于会议时间安排出现冲突,ICNSCM2016会议延期至6月18-19日召开,会议收录的所有文章将于会前提交给出版社。给您造成不便,我们深表歉意,如有任何问题,请及时联系我们。联系电话:024-83958379-813,Email:cfp@icnscm.org。由于会议延期,增加一轮征稿,欢迎广大老师,学者踊跃投稿。具体会议日程请于会前半个月关注官方网站。谢谢。

Good News: The Notification of Acceptance of third round has been send to authors who have submitted their papers before March 14. At the same time, the registration process has started accordingly. Please finish the registration before March 29, 2016. Please feel free to contact us, if you have any questions.

好消息:2016年3月14日前投稿的作者请注意,三轮征稿的录用通知已经发送到您的邮箱当中,请注意查收。同时会议的注册工作已经开始,请在2016年3月29日前按时完成您的注册。如有问题,请及时联系我们。

Good News: The final round of calling for paper begins, and the submission deadline has been extended to April 19,2016. Please grasp the chance and submit your paper.

好消息:ICNSCM2016最后一轮征稿已经开始,本轮截稿日期为2016年4月19日,请大家抓住机会投稿!

Good News: The Notification of Acceptance of second round has been send to authors who have submitted their papers before February 15. At the same time, the registration process has started accordingly. Please finish the registration before February 29, 2016. Please feel free to contact us, if you have any questions.

好消息:2016年2月15日前投稿的作者请注意,二轮征稿的录用通知已经发送到您的邮箱当中,请注意查收。同时会议的注册工作已经开始,请在2016年2月29日前按时完成您的注册。如有问题,请及时联系我们。

Good News: The third round of calling for paper begins, and the submission deadline has been extended to March 14,2016. Please grasp the chance and submit your paper.

好消息:ICNSCM2016第三轮征稿已经开始,本轮截稿日期为2016年3月14日,请大家抓住机会投稿!

Note: Dear author, the committee is on vacation from February 3 to February 14 and will continue working on February 15. If you have any questions, please contact us at cfp@icnscm.org.Happy new year!

通知:尊敬的各位作者,会务组全体员工2月3日至2月14日进入假期状态,2月15日正常上班。如有问题请发邮件至cfp@icnscm.org,我们会及时为您解决。祝大家假期愉快!

Good News:The Notification of Acceptance of first round has been send to authors who have submitted their papers before January 11. At the same time, the registration process has started accordingly. Please finish the registration before January 25, 2016. Please feel free to contact us, if you have any questions.

好消息:2016年1月11日前投稿的作者请注意,首轮征稿的录用通知已经发送到您的邮箱当中,请注意查收。同时会议的注册工作已经开始,请在2016年1月25日前按时完成您的注册。如有问题,请及时联系我们。

Good News:The second round of calling for paper begins,and the submission deadline has been extended to February 15,2016.Please grasp the chance and submit your paper.

好消息:ICNSCM2016第二轮征稿已经开始,本轮截稿日期为2016年2月15日,请大家抓住机会投稿!

Good News: As an official conference, ICNSCM 2016 has been successfully announced on MATEC Publications website. More detail, please click.

好消息:作为官方会议,ICNSCM2016已经进入MATEC出版官方列表,详情请点击

Nowadays, the developing of the modern high-tech polymer and composite materials play a more and more important role in the development of modern materials science and technology. The research depth, application scope and the production speed and scale of composite materials have become an important symbol when measuring the advanced level of materials science and technology.

The International Conference on Nanomaterial, Semiconductor and Composite Materials (ICNSCM2016) will be held on June 18-19, 2016 in Singapore. On behalf of the organizing committee, I would like to send my honest invitation to all distinguished scholars and engineers. As an academic conference, this event aims to bring together leading academic scientists, researchers, scholars and students around the world to exchange and share their experience and research fruits with professionals and industrial engineers. As an attendee, you will have access to the industrial products and get to know the requirements of enterprisers.

All papers accepted by ICNSCM 2016 will be published by the journal of "MATEC Web of Conferences"(ISSN Online: 2261-236X) that is contained the Ei Source List. The papers will be submitted to ISTP (CPCI-S), Google Scholar, CAS, Compendex, Inspec, DOAJ and Scopus.

Please note: the Conference organizers cannot promise any index services because the index service company has the final right to decide if the paper can be indexed.

We are looking forward to meeting you in Singapore and welcome you to present your precious work to our conference.

 

 

 
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